Ceramic Substrates

Thick-Film Printed Substrates with Thinner Thickness one

Electric Materials (Ceramic Substrates)

Product Summary

We could be able to supply lower height, light weight, higher toughness and higher accuracy printed substrate with our accumulated technologies in producing thinner thickness ceramic substrates.

Applications

Wearable, CSP, SAW Filter, Smaller Electronic Products, etc.

Function

Higher toughness, Lighter weight, Insulation property, Heat dissipation, Heat resistance

Features

・ Lighter weight enables with thinner thickness substrates
・ Higher toughness enables to handle in customers production process
・ Smoother surface roughness enables to be achieved with smoother circuits
・ Excellent dimension accuracy with 0.1%
・ With thinner thickness substrate (min 0.03 mm) enable to be able to lower height electronic components